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Original question:

SM320F28335-EP: V62/09624-01YE - 176 pin QFP, Corner Staking

SM320F28335-EP: Wire Bond Inspection Options

Ryan Wilson
Prodigy 10 points

Part Number: SM320F28335-EP

Tool/software:

Does TI offer any services to inspect the condition of the wire bonds within the package of this part?

I have tried x-ray inspection with limited success.

I am curious if there is a decapping process that could keep the wire bonds intact, but allow for visual inspection under high magnification.

Also, have other customers experienced issues with damaged wire bonds on these components? We are trying to rule out internal part damage as potential root cause for an electrical failure.

Thank you!

  • 0
    TI__Mastermind 36526 points

    Hi Ryan,

    Please see our policy for returns: https://www.ti.com/support-quality/additional-information/customer-returns.html

    Ryan Wilson said:
    I am curious if there is a decapping process that could keep the wire bonds intact, but allow for visual inspection under high magnification.

    We have this capability, but it is only done if your MCU failure meets our standard for a return, and then our quality engineers determine that the decapping process is absolutely necessary. This can be a fairly lengthy process, since decapping is usually a final step that comes after all other lines of investigation have been exhausted.. 

    Have you been working with a TI FAE? They can usually help with the return process.

    Best Regards,

    Ben Collier