Tool/software:
customer working on a PCB that has mostly lead-free components except for the TMS320F2812GBBA. They see that the peak reflow profile temperature for the TMS320F2812GBBA is 220C. Their assembly house uses forced air reflow to solder these components onto the PCB. Is there any data or information from studies, analysis or assessments that would allow them to briefly increase the peak reflow profile temp to say 235C? Some additional questions that I have are as follows:
-
How should peak reflow profile temp be measured for the TMS320F2812GBBA? From what they have found from some of TIs tech reports and datasheets, the temp for this chip is measured with a thermocouple mounted on the top middle surface of the chip. Is this correct?
-
If they was to exceed the peak reflow temp of 220C, how much can I exceed it by? Do you have any data or studies supporting this?
-
If they were to exceed the reflow profile temp to 235C temporarily (say 30 seconds), are there any parts of the TMS320F2812GBBA that I should be careful with exceeding a particular temperature? For example, if I can prove that the core of the TMS320F2812GBBA does not exceed 220C even though I had the 235C peak reflow for 30 seconds, would that be acceptable? In other words, is the core temp of TMS320F2812GBBA the most important measurement to determine whether or not a higher peak reflow profile temp would damage it upon soldering?
