TMS320F28388D: IEC 61508 FMEDA of TMS320F28388D in Cadence Midas Platform

Currently only the QFP package is supported. The BGA package will supported in the future. The package selection will only affect the package hardware calculations. The die calculations will not be significantly impacted. Therefore the QFP package can be used for your preliminary analysis. 

Hi,Gus,

Through the Cadence Midas tool, we get an Excel file, which shows that the package of TMS320F28388D is PTP（QFP）。 However, when it is actually used for IEC 61508 certification, BGA package is used。 We are worried that the package on the file does not match the actual package。 Will this effect IEC- 61508 certification?

I understand your concern. As previously mentioned, we are actively working to support the BGA package in the Midas RC tool. When do you need this BGA support?

Hi,Gus，

We are in the process of IEC 61508 certification。 It is in the early stages now, so we need to obtain relevant information as soon as possible。 Thank you。

BR，

Vincent。

Understood. I will update this thread once we have a target date for this support. 

Hi, Gus,

As the IEC-615085 certification is in progress, we would like to know when TI can provide FMEDA data for BGA package. Thank you very much.

BR,

Vincent.

Hi Vincent,

I do not have a timeline for this support. If you are in urgent need of this information, please refer to the F2838x_Baseline_FMEDA_Report_PTP_v0p94_GA.xlsx report included in the safety package. In this report you will find the pin FMEDA sheet which includes failure mode distribution for all the pins on the BGA package. You can use this information for your analysis.