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TMS320F28379D: TMS320F28379D

D VENKATESWARA RAO
Prodigy 10 points

Part Number: TMS320F28379D

Tool/software:

Pl clarify that the above device having ground will be center of IC which the data sheet provides 

SOLDER MASK DEFINED PAD (page no : 243 in data sheet)

As per the above we are taken grounding path taken only SOLDER MASK DEFINED PAD

It was correct or not

Page Number 243 in data sheet 

  • 0
    TI__Expert 5040 points

    Apologies for the delay,

    Yes, the solder mask defined pad you are referring to is the ground PowerPAN on the bottom of the package and should be soldered to ground. 
    For all ground (VSS) pins/pads, please see the relevant lines in the Signal Descriptions table (page 37 and 38).

    Regards,

    Susan