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TMS320F28379D: F28379D Lauchpad

Part Number: TMS320F28379D


Tool/software:

We are using the F28379D Launchpad and supplied by the 3.3 V externally. The maximum current drawing is around 180 mA.

I have a question as follows:
  1. What is the maximum and minimum temperature that the TI F28379D Launchpad can function properly? Can you please confirm?
  2. Is there any thermally enhanced product available that we can consider to migrate with minimum changes from F28379D Launchpad?
  3. Any suggestions to improve the thermal performance?
  • Hi,

    The LaunchPad generally has a recommended operating range of 0°C to 85°C. While the C2000 device may be rated for higher not all other components used match this.

    • Commercial Temperature Range: 0°C to 85°C
    • Industrial Temperature Range: -40°C to 105°C
    • Extended Temperature Range: -40°C to 125°C (available for specific part numbers)
    Any suggestions to improve the thermal performance?

    From a PCB / HW design perspective or other? Some suggestions below:

    1. Add a heatsink to the processor - even a small heatsink can significantly improve thermal performance
    2. Improve airflow around the board with fans or proper enclosure design
    3. Reduce clock frequency during high-temperature operation to lower power consumption
    4. Implement low-power modes when full processing power isn't required
    5. Add thermal vias under the processor if designing a custom board
    6. Use thermal interface material between the processor and any heatsink
    7. Consider conformal coating for harsh environments (though this may slightly reduce thermal dissipation)
    8. Optimize your code to reduce processing load and power consumption

    Best,

    Kevin