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TMS320F2812: DIE changed in the SPRZ492A

Lucas Cunha
Prodigy 55 points
Part Number: TMS320F2812

Tool/software:

Hey team.

I use the TMS320F2812ZHHx in 2 devices.
In the SPRZ492A there are addressed slight changes to the packing and the change of the uBGA to nfBGA (and the substrate), but it also states the new product is "datasheet-equivalent electrical performance. It is also footprint equivalent to the MicroStar BGA."

I have some doubts regarding this, could you please help me?

1. There was any othe change in the sensor?

2.Due to the package change does de DIE changed too?

3. Due to the new BGA and substrate, is there any impact on the temperature/heat?

4.The Replacement Code for (ZHH to ZAY) was Q ("same functionality and PIN-OUT as the comparede device but is NOT as exact equivalent), in what point it's not exat equivalent?

Thank you.

  • +1
    TI__Mastermind 23410 points

    Hello Lucas,

    To address your questions:

    1. What sensor are you referring to? No, there were no changes to the sensor/die functionality. The SPRZ492A document specifically states that the new product has "datasheet-equivalent electrical performance". The changes were limited to the package construction and substrate material.

    2. There was no change to the die. 

    3. The device still meets any temperature specifications listed in the device datasheet. 

    4. Is this in reference to our cross reference tool?

    Best Regards,

    Allison

  • 0 in reply to Allison Nguyen
    Prodigy 55 points

    Hey Alisson! Thanks.

    1. the sensor I'm actually referring to the DSP, thanks.

    2. OK

    3. OK

    4. Yes in the PCN20201117001.3 states that the replacemente code from TMS320F2812ZHHx to TMS320F2812ZAYx is "Q" (same functionality and PIN-OUT as the comparede device but is NOT as exact equivalent). They are not exctly the same due the package and substrate change?

    Thanks again

  • +1 in reply to Lucas Cunha
    TI__Mastermind 23410 points

    Hi Lucas,

    4. Yes, the Q simply refers to the package/substrate change. The die function is not affected by the change in package and will still meet the given datasheet electricals. 

    Best Regards,

    Allison