TMS320F2812: Qualification and Reliability report

Lucas Cunha

Part Number: TMS320F2812

Tool/software:

Hello.
Checking the PCN20201117001.3, where the BGA substrate and the Package mold were changed, I found a Qualification Results.
But neither in the Qualification Report (nFBGA) Approve Date 20-Jan-2020 neither in the Qualification Report (nFBGA) Approve Date 08-Apr-2020 I found the qualification for the TMS320F2812.

Could you please tell me what was the PN used to validate the TME320F2812 by "QBS Package Reference"?

Thanks

4 months ago

0 Allison Nguyen 4 months ago

TI__Mastermind 25560 points

Hello,

Could you please send me the PCN? Please note there was no change to the device die, and the electricals remain adherent to the datasheet specs.

Best Regards,

Allison

0 Lucas Cunha 4 months ago in reply to Allison Nguyen

Prodigy 65 points

PCN20201117001.3.pdf

Hey Alisson, follow the PDN.
I understand that no change to DIE was made, my main question is what package (or PN) was used to validate this DSP in the quality report (in the attached file).
thanks

0 Allison Nguyen 4 months ago in reply to Lucas Cunha

TI__Mastermind 25560 points

Hi Lucas,

Thanks for the attachment. Let me check internally and get back to you.

Best Regards,

Allison

0 Allan Webber 4 months ago

TI__Intellectual 1750 points

The qualification of the nFBGA devices in the reported document would have been at a broad nFBGA family level. This report covered devices from multiple silicon technologies and body sizes of the nBGA package sizes. The F2812 device is a 12 x 12 mm nFBGA and this would be covered by the TPS659038IZWSRQ1 device which is also a12 x 12 mm.

The nFBGA package using the bill of materials is a mature package technology in this assembly site and widely used for industrial and automotive products.

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TMS320F2812: Qualification and Reliability report