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TMS320F28P650SK: Inquiry Regarding TI DSP/IC Performance and Compatibility in Immersion Cooling Environments

Part Number: TMS320F28P650SK

Hi Sir

The customer is currently evaluating the feasibility of applying TI DSPs( F28P650/F28P550/F2800137) in an Immersion Oil (Liquid Cooling) environment. We are seeking confirmation and technical data from TI regarding any previous experience or test results in this field.

We would appreciate your insights on the following:

1. Application Experience & Case Studies
Experience: Does TI have existing experience with DSPs or other ICs (e.g., MCUs, SoCs, PMICs) being deployed in immersion oil or liquid cooling environments?

Documentation: Are there any relevant application notes, white papers, or field data available for reference?

2. Material Compatibility
Regarding long-term submersion in cooling fluids, are there any known risks or test results for TI components? Specifically:

Package & Substrate: Does the IC packaging material (mold compound, substrate, etc.) maintain integrity?

Fluid Compatibility: Has TI conducted compatibility assessments with specific fluids, such as mineral oil, synthetic oil, or fluorinated oils (e.g., 3M Novec or similar)?

Thanks.

  • Hello,

    This thread has been assigned to corresponding subject matter expert, who is is out of office until tomorrow. Please expect a reply within the next few days.

    Best,
    Matt

  • Wilson,

    We do not have this information for our MCUs, we only test with JEDEC standards, assuming free air.

    With that said, all TI devices pass BHAST, which one component is moisture ingress.  In theory, since oil has higher density than water, there should be no ingress, if the oil is kept a standard atmospheric pressure.

    But there is no formal documentation or testing that I am familiar with for C2000 MCUs.  I searched a bit across other TI MCUs(MSP, CC, etc) and wasn't able to located any info for those devices either.

    Best,

    Matthew