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TMS320F28069 - Internal vs External Oscillator

Other Parts Discussed in Thread: CONTROLSUITE

Hi, im currently designing a custom Board with a F28069  and im a little bit confused reading the Design Guidelines for the Oscillator Designs.

It is said, that there are two ways of configuration: internal with a crystal and two capacitors and external with an external oscillator.

First Question (internal configuration) :

-Are the capacitors (C1, C2, see the picture below)  real capacitors and  i have to use on the board design or are they for substituton of the crystal curcuit? do they have to be a special kind of capacitors (are ceramic caps working) ?

-CLoad has to be around 12pF. So if im picking two capacitors depending on the equation in wich capacity range/area do the caps have to be ? also pF? nF? or higher?

-The crystal has to be chosen also with 12pF, right?

-Will the USB Module and the Serial interfaces work with this configuration? i found some posts saying that the internal configuration is a bad choice for the serial interfaces but im not sure wich configuration is meant.

-What is the device doing if you leave the pins unconnected? just out of curiosity.

One more for the external Configuration:

Do you know any good Design Guidelines for designing an external Oscillator curcuit? Couldnt find some in controlSuite/internet yet.

Thanks a Lot!

  • Tackle the 1st question first.

    C1 and C2 are actual capacitors that you need to connect in the circuit . They need to be highly stable (COG, NPO dielectric, 1% tolerance). Typically say for a 20Mhz quartz crystal, 22pf C1 and C2 will be good. For other crystal values you need to check the crystal datasheet for the resonance capcitors to be attached.

    Vivek

  • Randy,

    I wanted to clarify some.  I know that the documentation can be complicated.  For the Piccolo F28069 there are several clock source choices:
    1) Internal oscillator 1 (no external components needed; source is generated in-chip)
    2) Internal oscillator 2 (no external components needed; source is generated in-chip; osc 2 is often used as a backup for internal osc 1)
    3) Crystal/resonator + load capacitors for use with on-chip crystal oscillator
    4) External clock source via external oscillator

    Option 1 and 2 will be less precise over temperature than the other options and therefore may not 'by default' meet some timing specs for certain applications.  (I say 'by default' because there is a way to calibrate the oscillator at different temps during operation, but this will use up some cycles). 

    However, I would say that the majority of the F2806x's customers use option 1.  Option 3 is a bit more precise over temperature and option 4 is the most precise (but also the most expensive).

    Running CAN on an MCU (and meet CAN's specifications) is an example of a situation which may require connecting something external.

    Vivek above has accurately described the setup for Option 3 which is what you asked about.

    See page 76 of the following for more information: http://www.ti.com/lit/spruh18


    Thank you,
    Brett

  • Hi,

    Your description suits the user manual, but for the F28069 controller-card's

    data sheet appears that between the X1 and X2 pins a 20MHz oscillator is connected, instead of a

    crystal/resonator - see figure:

    It's quiet confusing - is it a crystal or an oscillator? am I missing something out?

    The data sheet is attached below.

    Thanks,

    Amitai

    F28069controlCARD-SCH[R1.1].pdf

  • Hi Amitai,

    If you take a look at the Bill Of Materials for the F28069 ISO controlCARD (which matches the schematic you attached), you'll find that the component X1 is actually a crystal. 

    I understand that this is a bit confusing since the schematic labels X1 as an OSC.  I will file a bug to have this label removed in a future version of the schematic.

    Hopefully this helps!


    Thank you,
    Brett

  • Thanks much,

    Amitai