Using PFP package without PowerPad on PCB?

Alex Segura

Hi all,

I'm developing a small control board with Piccolo 28069U and I've realized that could make my first version with a Sample from TI. The samples available are 28069PN (without PowerPad) and 28069UPFP (with USB+PowerPad). I would like to include the device with USB peripheral, but the free sample comes with PowerPad.

My question is: what could happen if I use the PFP package without any copper on PCB to dissipate heat? And, if I make a copper plane for the PowerPad but I don't solder it but I put thermal paste? Is it going to be better or worse than the PN package?

Many thanks!

over 12 years ago

0 Igor Gorbachev over 12 years ago

Guru 20525 points

Hello Alex!

Perhaps this materials will be useful

http://e2e.ti.com/support/microcontrollers/c2000/f/171/t/159373.aspx

2133.TI_thermal_pad.pdf

4745.TI_PackageThermalMetrics_spra953b.pdf

Regards,

Igor

0 Gautam Iyer over 12 years ago

Guru 192875 points

Hi Alex,

Thermal paste should do the trick, but then powerpad for heat dissipation is must else controller would heat up & keep resetting after certain amount of continuous testings.

Also if you're planning to use thermal paste, try to have a min. of 3 times(of controller) area for the powerpad.

Regards,

Gautam

0 ChrisClearman over 12 years ago in reply to Gautam Iyer

TI__Guru** 119680 points

Alex,

The powerpad is meant for heat dissipation and is not an active ground. The only time the powerpad connection is critical is if you are running the device at the upper temperature limit and at full spec frequency. At lower temperature you should be fine as long as it’s for development purposes only.

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Using PFP package without PowerPad on PCB?