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TMS320F2812 PTP package Exposed pad connection

Other Parts Discussed in Thread: TMS320F28335

I'm finalizing a design using the 28335 PTP package which has a exposed pad. It is not clear in the datasheet nor the thermal TI application note "PowerPAD Thermal Enhanced Package" (SLMA002G) cornering connecting the exposed pad to circuit common (GND / VSS).

The only electrical reference in the TMS320F28335 datasheet (SPRS439M, Revised August 2012) is on page 14 and states; "The powerpad on the bottom side of the PTP package is not connected to the ground (GND)
of the die. " 

Does this imply that the pad is electrically isolated and would allow connection to circuit common (GND / VSS)?

  • Hi Gerald,

    We guys were stuck at this point too way back. After researching a lot for F28335, also getting inputs from both TI and non-TI experts we connected it to the ground. Our control card is functionally stable and is very efficient.

    Regards,

    Gautam