Other Parts Discussed in Thread: TMS320F28335
I'm finalizing a design using the 28335 PTP package which has a exposed pad. It is not clear in the datasheet nor the thermal TI application note "PowerPAD Thermal Enhanced Package" (SLMA002G) cornering connecting the exposed pad to circuit common (GND / VSS).
The only electrical reference in the TMS320F28335 datasheet (SPRS439M, Revised August 2012) is on page 14 and states; "The powerpad on the bottom side of the PTP package is not connected to the ground (GND)
of the die. "
Does this imply that the pad is electrically isolated and would allow connection to circuit common (GND / VSS)?