Hello All,
Please see the attached:
In the Control Card board files, this was done even though the TMS320F28069UPZT is a PZ-100 part, not
a PZP-100 part, so the above would not connect to any exposed thermal pad underneath the part.
So, does the TMS320F28069UPZT still need this - to help conduct heat away from the part - or would it be largely
superfluous on a non PZP part?
The TMS320F28069UPZT has this land pattern: LQFP (PZ) | 100.
I suppose the GND plus 81 vias could be kept in case the higher-temp part were to be loaded.
Thanks In Advance,
John W.
