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TMS320F28377S- CAD files error

Katerina Pilnackova60
Prodigy 90 points
Other Parts Discussed in Thread: TMS320F28377S

Hello,

we have customer reporting, that on the provided CAD/CAE symbol/footprint using Ultra Librarian to extract the footprint/symbol on

http://www.ti.com/product/TMS320F28377S/quality#cadsymfoot

seems to be incorrect/erroneous (at least for Cadence ORCAD).

After loading the .bxl file of the TMS320F28377S (the .bxl file for the HLQFP package, 176 pins), he was setting up the user interface. He uses the latest version of Cadence ORCAD Schematic and PCB-Designer. When opening the generated schematic symbol it seems not to be the desired microcontroller as it has 176 pins - there are multiple pins drawn on top of each other.

 

Best regards

Katerina

 

Texas Instruments

ASKTEXAS Communications

  • 0
    TI__Expert 5540 points
    Katerina,

    We are looking into this, will get back to you soon.

    Best regards,
    Jason
  • 0 in reply to Jason Whiles
    TI__Expert 8105 points

    Katherina,

        This is what we get when we exported to Orcad and Allegro (see attached). Can I get the files that you exported?

    Regards,
    Petertms320f28377s_bxl.pdf

  • 0 in reply to Peter Galicki
    Prodigy 90 points

    Hi Peter,

     

    as you can see on the pdf, the microcontroller symbol is split into 4 parts although it is a single device.

    For customer, it seems that Ultra Librarian has assigned to each of the four parts the same footprint. This is why

    you can see 4 times the same footprint superimposed on one another. You can see this if you have a close look

    at the pins of the footprint after opening it with ORCAD PCB Editor or Allegro.

    In my understanding, splitting a single microcontroller into 4 parts is not possible in ORCAD. This leads to problems

    when trying to design a Layout.

     

    regards

    Katerina

     

  • 0 in reply to Katerina Pilnackova60
    TI__Expert 8105 points

    TMS320F28377S_PZP_100.zipKaterina,

    Sorry for the delay, our Forum form had trouble attaching the .bxl file I was trying to send.

      Yor issue was with the vias in the footprint. I am attaching the footprint without vias for you.

    Regards,

    Peter

  • 0 in reply to Peter Galicki
    TI__Expert 5540 points
    Adding some detail to the forum post from email.

    The bxl files attached here do not have VIA's in the PowerPad area of the footprint, the customer will need to add these in their PCB.

    With this device the central thermal pad is also the VSS connection for the device so it is critical that there is a solid electrical connection to PCB VSS through this PowerPad. Please have the customer review the Datasheet Terminal Functions and the Mechanical Packaging and Orderable Information sections for details. The datasheet should be used in conjunction with the bxl.

    Best regards,
    Jason