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TMS320F28335: Thermal resistance at high altitude

user3300657
Prodigy 30 points

Part Number: TMS320F28335

Hi,

I am considering operating this device at high altitude.
Atmospheric pressure is lower at high altitude, so I am worried that heat radiation will be worse.
How do I think about the thermal resistance of this device?

  • 0
    TI__Guru* 95315 points

    I checked with some Packaging/Quality experts and got the following feedback:

     

    "TMS320F28355 has 4 package options. Regular QFP, Powerpad and 2 flavors of BGA.

     

    This situation of thermal radiation being the primary heat transfer path, is the concern for the Regular QFP version. The contribution of heat going from leads into the solder joints / PCB will be small.

     

    For the BGAs, the primary heat conduction path off the chip is through the BGA solder balls into routings and then the PCB. It will be better than the QFP.

     

    The Powerpad is the best efficient method where heat is transferred through a thermal pad directly underneath the package that goes to a copper pad on the PCB. If thermal management (and Board Level Reliability) is a factor, then TMS320F28335PTPx is a better solution.  Now as for getting heat off that PCB, that is a completely different discussion.

     

    Please also review http://www.ti.com/lit/an/spra953c/spra953c.pdf Semiconductor and IC Package Thermal Metrics"