TMS320F28335: Need Soldering Profile for this device

3426.GC 10-EN.zipSoldering methods depend on many factors including type of components to be soldered, assembly house assembly process used, leaded vs. lead-free paste, etc. For starters. Typically you don't want to exceed the maximum soldering temp of 160 deg C. Also see attached solder paste document that includes solder part number and re-flow profiles for solder paste that we have successfully used to assemble some of our internal test boards.