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TMS320F28235: Vibration test

Jordan Zhou
Genius 10170 points
Part Number: TMS320F28235


Hi, 

Customer asked if F28235 Q100 version had the vibration test in our lab?

They did a 10G test and found some physical broken. 

Any comment?

Thanks a lot.

Br, Jordan

  • 0
    TI__Guru* 95315 points
    Jordan,
    Can you provide more information on "physical broken"?
  • 0 in reply to Hareesh Janakiraman
    TI__Guru* 95315 points
    I also need the package information. The complete part number would be helpful.
  • 0 in reply to Hareesh Janakiraman
    TI__Intellectual 1750 points

    Q100 requires vibration tests on an IC qualification ONLY if it is a cavity package. For plastic packages, it is not a required test. However, since these parts are available for automotive markets, many of our automotive customers have run vibration testing on systems that contain the TMS320F28235 or similar components.

    The primary interface of investigation during system level vibration tests is the solder joint. TI has no reports of such devices ever having problems with the internal interconnections of the IC.

    If the problem is with the solder joint, it is recommended the customer should perform a more failure analysis on how it failed. Board design, solder process and solder joint materials may influence performance to such a test.

    Note: there are 2 package versions of the TMS320F28235 for automotive grade offering. TMS320F28235 comes in a powerpad QFPs and a BGA version.