Part Number: F28M36P63C2
Other Parts Discussed in Thread: CONTROLSUITE
a) I downloaded the file F28M36P63C2_ZWT_289.bxl from the TI website and then opened it in Ultralibrarian. From Ultralibrarian I then exported the footprint to Altium. Here the footprint pads have a diameter of 0.55 mm and there is solder mask present
b) In controlSUITE there is under “Development Tools ==> controlCARDS ==> controlCARD Hardware Files ==> F28M36x 180pin controlCARD w/ Isolated Emulation” files for the control card with a F28M36xxxx. Here the pads have a diameter of 18 mil = 0.4572 mm and there is also solder mask present.
c) I also found this document http://www.ti.com/lit/an/spraca4/spraca4.pdf named “AMC57xx” BGA PCB design. In table 1 here IPC-7351A for NSMD (non-solder mask defined) pads are reproduced. It here lists for BGAs with a nominal ball diameter of 0.5 mm (the same diameter as on the F28M36P63C2 package) that a nominal pad diameter of 0.40 mm is recommended.
I have not used smaller than 1 mm pitch before and now I am going to 0.8 mm for the first time and want to be a bit careful.
I think it will be hard to add (reasonably sized) via holes between the pads if I use a pad diameter of 0.55 mm and also to route out the signals since only 0.25 mm remains for the conductor and two isolation distances? In the control card example with a pad diameter of 0.4572 mm they have managed to add via holes between the pads and route signals out but then they also have 0.3428 mm available.
How does TI really recommend the footprint should look like for this package?
