We are building a PCB for TMS320F28379D MCU. We understand that there are 4 packing options for that MCU (Lead-Free, ZWT, PTP & PZP). Will we be able to have access to the following functionalities in using any of these packaging options;
169 GPIOs pins, 24 ADCs pins, 24 PWMs pins, 3 DACs pins, 8 SD Filters pins & the 7 communications systems (1 x USB, 2 x CAN, 3 x SPI, 2 x CAN, 2 x I2C, 1 x uPP, 4 x SCI & 2 x McBSP).
The question is posed because of the different number of pins/balls of the packaging.
Will more MCU pins/balls mean we can access more of these functions at the same time?
In that case to maximize the number of functions we can access at the same time ZWT would be the preferred packaging option. Correct?
Regards
Sam
