I'm curious why footprint display the letter pin numbering scheme is upside down when I compared it with package outline pdf file?
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MJ,
Thanks for the question. The package outline drawing is a bottom-up view of the package as it is flipped over. The footprint is top-down how it interfaces with the PCB when mounted. If you check the next pages of the PDF you will see the flipped solder mask and solder paste details which match the CAD drawing from the Ultra librarian.
Let me know if you have any more questions.
Best regards,
Jason