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TMS320F28069M: Thermal management and heat sink

Kash Olia
Genius 3215 points

Part Number: TMS320F28069M

Hi,

I'm looking for a thermal management solution for my TMS320F28069M controller and was wondering if there is any document describing different types of heat sinks for this MCU and how to implement them.

Thanks,

 

  • 0
    TI__Mastermind 42195 points

    Khashayar,

    Its very uncommon for users to implement a heat sink for this device. Is there a reason why you think that you will need one?

    Typically just the PCB that the device is soldered to is enough to dissipate heat from the MCU. Occasionally you can experience negative effects if there is some localized PCB heating due to nearby components.

    Here is one of my favorite app notes on heat dissipation. http://www.ti.com/lit/an/snva419c/snva419c.pdf 

    Regards,
    Cody 

  • 0 in reply to Cody Watkins
    Genius 3215 points

    Hi Cody,

    Thanks for your message. 

    I designed a controller board with this MCU two years ago and it used to get hot (not that much to burn your finger when you touch it). I'm designing a different controller board this time with the same MCU and am using much more software and calculation this time. I'd expect to have the MCU overheated and would like to have a heat dissipation solution beforehand. 

    I'll take a look at the document you sent me.

    Thanks,

  • 0 in reply to Kash Olia
    TI__Mastermind 42195 points

    Kash,

    even under full load this device should not get uncomfortably hot to the touch just from its own current draw and leakage. I expect it to get warmer than ambient, but if you are following the datasheet recommendations it should not become a problem under normal operating conditions.

    As long as you had a some sort of ground plane under the device that could soak up a bit of heat you should be fine. Did you ever measure the current draw of the C2000 device in your previous design? Maybe you had something that was sinking or sourcing unexpected current through the C2000?

    Regards,
    Cody 

  • 0 in reply to Cody Watkins
    Genius 3215 points

    Cody,

    I did not measure the current draw of MCU but you may be right. It might be drawing/sinking an unexpected current value. I'll double check.

    I just noticed that I have ordered the PZ series for MCU which is not PowerPAD Thermally Enhanced model. I had designed a two layer PCB board, so based on your recommendation I need to design a three layer PCB board and dedicate one layer as a ground plane under the MCU to soak the heat up. 

  • 0 in reply to Kash Olia
    TI__Mastermind 42195 points

    Kash,

    i'm sure that a 2 layer board is possible as long as you have a reasonable thermal connection. Please note i doubt you'll find a vendor willing to make a 3 layer board, you will have to jump up to a 4 layer board if you decided to go with that approach.

    Additionally, when creating 2 layer PCB designs, without ground planes, i would expect your analog performance to degrade somewhat. This would be due to cross talk and large ground loops.

    Regards,
    Cody 

  • 0 in reply to Cody Watkins
    Genius 3215 points

    Cody,

    You are right, I'm looking into 4 layers PCB.

    Ground loop was not my concern in my previous design, but for this new design it's one of the things I'm paying close attention to as this board is bigger and more complicated. 

    Thanks for your advice.