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TMS320F28377S: desoldering HLQFP-176P in factory

Sheldon He
Expert 8585 points

Part Number: TMS320F28377S

Hi expert,

Do you have any advice and how to re-work HLQFP-176P package F2837x in factory? This may including desoldering and soldering. Any guideline from TI or third party may help!

Thanks

Sheldon

  • 0
    TI__Expert 8105 points

    Sheldon,

    To remove the 176 package we would follow these steps:

    1)  Heat up the board from underside for the entirety of this process

    2)  Put lots of flux on the package pins

    3)  Use the hot air gun to direct hot air on the pins around the package until package is loose, then push it to the side (this could take a minute or two)

    4)  Remember to also direct air gun to the center of the package where the PowerPad is soldered to the board.

    5)  Afterward use solder wick to remove excess solder from pads.

    Regards,

    Peter