This thread has been locked.

If you have a related question, please click the "Ask a related question" button in the top right corner. The newly created question will be automatically linked to this question.

CCS/TMS320F28377S: ZWT nFBGA emif communication error

Part Number: TMS320F28377S
Other Parts Discussed in Thread: TMDSCNCD28379D, LAUNCHXL-F28379D

Tool/software: Code Composer Studio

HI,

Our team using TMS320F28377SZWTS for product,and now some board emif communication error in 80℃ enviroment or hand touch chip,how is that?

Reflow temperature is not complete according to SPRAA99B recommend,this is OK? nFBGA package fo reflow temperature is strict requirements?

  • Hi,

    Please note that many of our subject matter experts are out of office this week due to a US holiday, including our EMIF experts, but I can point you to this app-note which may be of use if you haven't already seen it: Design and Usage Guidelines for the C2000™ External Memory Interface (EMIF)

    Do you have a specific reason you suspect your EMIF issue is related to the package or reflow process?  For example does you EMIF code work robustly across temperature on TI hardware such as TMDSCNCD28379D or LAUNCHXL-F28379D or do you have a similar software project running in a different package without issue or have you recently changed your reflow process?

    Regards,

    Joe

  • Thanks for your reply,

    Similar software project running TMS320F28377SPTP is normal in 80℃ environment or hand touch chip,so I suspect the package different cause the problem.

    Reflow process change appear different defective rate.

  • OK at this point we'll need to wait for the assigned expert to return, you can expect the next reply by Tuesday or Wednesday of next week.  I'm sorry for the delay.

  • user6261387 said:
    Reflow temperature is not complete according to SPRAA99B recommend,this is OK? nFBGA package fo reflow temperature is strict requirements?

    The recommended reflow profile is desirable to ensure proper alignment and electrical connectivity. It may be possible to develop alternate profiles that work, but this would be done at the assembler's own risk. TI can only support devices which are installed using the published guidelines due to the number of influential variables which may contribute to problems.

    user6261387 said:
    Similar software project running TMS320F28377SPTP is normal in 80℃ environment or hand touch chip,so I suspect the package different cause the problem.

    This is a reasonable suspicion, especially with the sensitivity to mechanical pressure from touching.  Layout would typically be another factor to investigate due to the differences in signal breakout between BGA and QFP, but these potential effects would not be very sensitive to pressure.

  • Thanks for your reply,

    The problem has been solved,the reason is the software configuration,GPIO36/EM1WAIT pin is NC in the board,but EMIF program configuration is external mode cause this problem.