Other Parts Discussed in Thread: MSP430G2553, MSP430F1612
Hi,
I am currently using the MSP430g2553 IC. This works well using the EXP-430G2 development board as it is a DIP package. My question is if I use an IC such as the MSP430F1612IP (LQFP package) can I still use it as a break out to connect to the MSP430F1612IP ? Alternatively are there any diagrams available or boards available to solder these IC's onto with USB connection?
Many thanks,
clueless.
