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MSP430F5528：MSP430F5528IRGCT sideband + reel baking temperature

Meng jeffrey
Expert 2760 points
Part Number: MSP430F5528


MSP430F5528IRGCT's moisture rating (MSL) is level 3,
According to the J-STD-033D standard, it must be consumed within 168 hours after opening the package.
It is impossible for us to consume a total of 2500pcs in 168 hours.
Therefore, it is necessary to bake the remaining IC.
The IC is a sideband + reel package, hoping to provide a higher baking temperature for the side and reel used, so that we can determine the baking conditions.

  • 0
    TI__Mastermind 23295 points

    Normally, the side and reel packing material is low temperature packing material, the baking temperature should below 40C.

    If you would like to bake devices at high temperature when exceeding floor life, recommended to remove the devices from the side and reel packing. The high temperature packing material like metal tube or tray can be considered to re-pack or hold those devices at backing>40C.

    There were reference backing condition as in the J-STD-033D, and for higher baking, but for high temperature packaging material.

    Or, you can consider using dry cabinet which spec can be found in J-STD-033D as well. 168 hours is frozen during device is stored in the dry cabinet.

  • 0
    TI__Mastermind 23295 points

    Normally, the side and reel packing material is low temperature packing material, the baking temperature should below 40C.

    If you would like to bake devices at high temperature when exceeding floor life, recommended to remove the devices from the side and reel packing. The high temperature packing material like metal tube or tray can be considered to re-pack or hold those devices at backing>40C.

    There were reference backing condition as in the J-STD-033D, and for higher baking, but for high temperature packaging material.

    Or, you can consider using dry cabinet which spec can be found in J-STD-033D as well. 168 hours is frozen during device is stored in the dry cabinet.

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