DRV2605: Which is the best land pattern document for DRV2605YZF

John Wright

Expert 1390 points

Part Number: DRV2605

Hello,

For laying out PC board for DRV2605YZF BGA package, which is the best land pattern document to follow:

I have seen 2 documents listed on the TI site. They are different.

One is titled 'YZF0009 YZF (S-XBGA-N9) 4219558 (Rev. N)', filename YZF0009.pdf.

The other is titled 'YZR R-XBGA-N9 4215046', filename YZR0009.pdf.

I have questions about terminology in these documents, but can we start by identifying the correct document to follow?

Can you please post a link to the recommended document to follow?

Regards,

John

0 Arthur Brown over 3 years ago

Regards
Arthur

0 John Wright over 3 years ago in reply to Arthur Brown

Expert 1390 points

Thanks Arthur,

On the Package Outline page at the bottom left it shows the position tolerance is 0.015M | C | A | B.

Can you explain what this means, including what the C | A | B indicates?

Regards,

John

0 Arthur Brown over 3 years ago in reply to John Wright

Hi John,

I will get back to you once the US team is back in office after the 4th.

Regards,

Arthur

0 Arthur Brown over 3 years ago in reply to John Wright

Hi John,

It appears this is GD&T (Geometric Dimension and Tolerance) it seems that this is means the solder ball needs to be within 15 microns of roundness

Regards,
Arthur

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