please give OUTPUT CURRENT CAPACITY @ 75℃ for both package.
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We recommend performing the calculations provided in 11.3 Thermal Consideration. From 7.5 Electrical Characteristics we find that the RDSON is 1.5Ω at 25°C and 1.8Ω at 85°C, so for your calculation I would probably use 1.75Ω.
If you'd like to see more explanation and calculations for thermal considerations I recommend checking out the DRV8899 Thermal Application section, it has a lot more equations and explanations on it that are applicable to the 8860 as well if you use the 8860's electrical characteristics.
See Figure 6. Maximum Current Capacity vs Duty Cycle when Paralleling Outputs for DRV8860PW for information about paralleling outputs, and the previous page has more information about the recommended output current, but these are all done at 25C.
Thanks your reply. and The customer want the data of max current vs. duty @75℃.
1. Please help provide with it or some guide to use it @75℃;
2. due to heat dissipation, can we ensure temperature rising will not go beyond 85℃ when IC work @75℃ for 0-100% duty cycle.
Please use the equation in 11.3 Thermal Consideration to calculate the power dissipated. The maximum amount of power that can be dissipated in the device is dependent on ambient temperature and heatsinking.
You can see these notes on how to use the PowerPAD at the bottom of the chip to help with heat dissipation as well: PowerPAD Thermally Enhanced Package (SLMA002), and the TI application brief, PowerPAD Made Easy (SLMA004).
At 100% duty cycle you might need to parallel some outputs to run at the desired current level. We don't have specific information on the chip for every temperature level, you might just have to test it.