DRV8243-Q1: thermal pad -> GND?

Hey Stefan,

The thermal pad on the HVSSOP (28) package  is designed to be soldered to a thermal pad on the board.  This doesn't necessarily have to be GND, but typically it is, Yes.  

Check out this document for a brief note on the best practices for our thermal pads (often called PowerPAD) - https://www.ti.com/lit/an/slma004b/slma004b.pdf

And this is the more in-depth version:  https://www.ti.com/lit/an/slma002h/slma002h.pdf

Regards,

Jacob