Hi,
I have two queries, first one is that we observed thermal shutdown of motor controller IC when it was continuously run for 48hrs at temperature of 65 deg C. Input voltage we applied was 500Vdc. When we observed continuous shut down of the motor, we looked at the controller and saw that the heat sink compound we applied was like melted in the sense it has been solidified and was about to come off the IC. So, my question is that when the heat sink compound is solidified or melted, does that affect the performance of the compound? Does that be one of the reason for thermal shutdown of the controller? Please help.......You can consider TI's motor driver controller as this query is being applicable to any IPM.
My second question is about the sensored controlled of BLDC motor using hall sensors. Does anyone have any reference document from TI based on the calculation of hall sensor position. Also, any technical document regarding the effect of hall sensor position change improves the efficeincy of the controller.
Thanks and Regards,
Ajay P
