DRV8245-Q1: What are the benefits of using a HVSSOP package over a VQFN package?

Hi Jennifer,

I will look into this inquiry and get back within 24 hours. 

Best,

David

Hi Jennifer,

Jennifer Jordan said:

What are the benefits of using a HVSSOP package over a VQFN package?

TI offers the following description on the package page on https://www.ti.com/ which is summarized below.

HTSSOP

"Small-outline (SO) packages include a dual row surface mount configuration with a wide variety of sizes and variations including SOIC, SOT, and all SOP spins (SSOP, TSSOP, VSSOP/MSOP). High utilization across many industries and high reliability makes this a standard package well-suited for numerous applications, including automotive and industrial. Packages are available with or without an exposed pad, depending on thermal and electrical requirements."

QFN

"Quad flat no lead (QFN) packages offer a leadless, small package size with a thermal pad giving good thermal performance. These are low profile, miniature devices in a robust, plastic package compatible with all end equipment including automotive. Dual lead version is referred to as SON."

An additional benefit of using the HVSSOP package includes the accessibility to solder to pins in case of debug or testing. 

Best,

David

Hi David,

Could you please clarify the exact benefits of the HVSSOP vs the QFN package?

Further, in the your answer you are referring to the HTSSOP instead of the HVSSOP package, what is the difference here?

Thank you.

Kind regards,

Wouter Kragt

Hi Wouter,

Let me provide you further details. The first package offering, HVSSOP are leaded packages. The second package offering for this device family is known as VQFN-HR aka hot rod package are unleaded packages. This is a DS (die size) package. You can look up mechanical information on TI packages on ti.com, https://www.ti.com/support-packaging/find-packages.html?keyMatch=PACKAGES.  

That said, first off the VQFN-HR offers the smallest footprint for a given variant of the DRV824x-Q1 family of devices. Because it is of DS it will be largest for the DRV8245 and smallest for the DRV8243. The VQFN-HR also does not have bond wires because it is DS. This gives some benefit with the power dissipation savings (no bond wire IR losses) but it is not that significant. On the contrary the VQFN-HR has much smaller physical area compared to the HVSSOP so heat density is higher. The HVSSOP has the die centrally placed in its lead frame and bond wires from the leads connect to the die. The HVSSOP may have more avenues for power dissipation taking advantage of the lead frame and the leads to dissipate the heat in the die in addition to the thermal pad. You may be able to find a few IC package related TI application reports discussing power dissipation and junction thermal resistance theta-j, they are good reading to understand this subject.

The junction temperature estimator provided in the product folder https://www.ti.com/tool/download/SLVRBI3 takes into account the thermal resistances of these packages for estimation. You can try plugging in the numbers and estimate which package gives best thermal performance for your application.

I hope this helps you understand the package differences for this family of products. Thank you for your post on this forum.

Regards, Murugavel