Hello,
I understand that the thermal pad on DRV8245 is our PowerPad design and have seen PowerPad documentation on recommended layouts. Meaning it is recommended to connect PowerPad to heatsink on PCB that can also be GND.
I do want to clarify however, is the PowrPad in the IC a floating net by default or is it connected to GND internally by default?
I see on this thread that in DRV8244 it is connected to substrate that is also connected to GND internally, please confirm if DRV8245 is the same: https://e2e.ti.com/support/motor-drivers-group/motor-drivers/f/motor-drivers-forum/1119433/drv8244-q1-is-thermal-pad-connected-to-gnd-internally-can-it-be-connected-to-any-potential?tisearch=e2e-sitesearch&keymatch=drv824%25252525252525252520thermal%25252525252525252520pad#
Thanks,
Alberto
