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MCT8316Z: MCT8316Z question

Part Number: MCT8316Z

Tool/software:

In our application we don't need the internal Buck Regulator therefore what is the ideal design configuration to disable this feature?

  • Hi Turguy,

    Are you willing to look at the MCT8316R? It is an SPI device with an option to disable the buck

    Thanks and regards,
    Sachin S

  • thank you very much Sachin. I will for sure use MCT8316ZR version. I have a follow up question with this IC:

    Per spec, max output current is 8 Amps as shown below:

    OUT (1) Peak output winding current OUTA, OUTB, OUTC 8 A

    Note 1 states "Power dissipation and thermal limits must be observed". However like various std Mosfet devices, i don't see SOA spec so I like to know if you can share the SOA for this internal FETs.  Note my application will use 24VDC supply and my DC current is below 3 Amps with PWM freq is 150KHz.

  • Hello Turguy,

    We currently do not provide the SOA information in the datasheet. I need to check with the team if you really need the specs.

    Thanks and regards,
    Sachin S

  • Hi Sachin. 

    Access to the Safe Operating Area (SOA) is crucial for determining whether this IC can meet the design requirements and for estimating the safety margins. I am uncertain about the current specification, which states a maximum current of 8A when the device is saturated, provided power dissipation and thermal limits are adhered to. However, the specification mentions 8A as a peak current, not continuous. Only the SOA chart or a similar graph can clearly specify the continuous current capability. This is why I am requesting this information.

    Regards

    TG

  • Hi TG, 

    Sachin is out for next couple of days. So let me add some comments here. Compared to discrete FETs, this is a integrated solution with gate driver inside. So the SOA has to be evaluated based on the abs max ratings of the device mentioned in datasheet. This includes, abs max voltage, peak current and max junction temperature. The continuous current rating has to be calculated based on the power loss, and resulting temperature rise (Tj). Approximate power loss and and temperature rise can be calculated based on you PCB conditions using the tool: https://www.ti.com/tool/download/BLDC-MOSFET-THERMAL-CALC

    Actual validation at the required current needs to be done on the board to estimate the power loss and temperature rise.

    Regards,

    Manu