DRV104: Solder voids

Tom Healy

Part Number: DRV104

Tool/software:

Hi,

I am looking to calculate the acceptable voiding on the solder thermal pad to ensure the limit of 135 degrees Celsius is not breached. Would you be able to provide the formulae/ calculations for this?

Kind regards,
tom

5 months ago

0 Ibinu Alaudeen Nadeera 5 months ago

TI__Genius 11731 points

Hello Tom,

Thanks for your question.

Can you confirm where the 135deg C limit is coming from?

The MSL ratings and reflow profiles can be found in the following application note https://www.ti.com/lit/an/spraby1a/spraby1a.pdf?ts=1742935658998&ref_url=https%253A%252F%252Fwww.google.com%252F

Hope this helps.

Thanks,

Ibinu

0 Tom Healy 5 months ago in reply to Ibinu Alaudeen Nadeera

Prodigy 10 points

Apologies,

This isn't to do with the reflow profile. More to do with the thermal connection between the GND pad at the base of the chip and the PCB during normal operation.

Thanks,
Tom

0 Ibinu Alaudeen Nadeera 5 months ago in reply to Tom Healy

TI__Genius 11731 points

Hi Tom,

Thanks for clarifying the question.

Let me check on this internally and will get back to you by end of the week.

Thanks,

Ibinu

Motor drivers

Motor drivers forum

DRV104: Solder voids