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DRV8329-Q1: solder area information

Part Number: DRV8329-Q1
Other Parts Discussed in Thread: DRV8329, DRV8353

Tool/software:

Hi,

My costumer requires an information for our process quality control regarding soldering quality of the exposed pad of the driver.
To ensure the quality of the soldering beneath the exposed pad it is checked by X-Ray.
With the image from the X-Ray cavities in the soler can be detected.

 

How much of the area of the exposed pad has at least to be soldered to the PCB ( % of the whole area) in order to ensure a good heat conduction and thus cooling of the device.
Of course, ideally the whole pad would be soldered without any cavity, but we would require a minimum value to set a threshold for the test.
Do you have any data or experience on that?

Thanks

Oscar

  • Hi Oscar,

    you can follow the guidelines in this app note:

    https://www.ti.com/lit/an/slua271c/slua271c.pdf?ts=1744138915336

    in Sections 4 Solder Paste Screen Printing Process

    I've also had this question asked before for a different device (with a similar package) and got in contact with some packaging experts and here was the insight they provided:

    "The center pad coverage is ideally in the 70 to 75%, too much and it tilts and too little causes it to “suck down” and flatten the terminal joints. The 20% reduction mentioned in the app note is already included in the design.

    Regarding Printing 4 squares vs. 9 - As long as the printed solder paste stays around the ~70% target (printed area/thermal pad area) even with 4 openings the QFN will be manufacturable"

    The device in question was DRV8353, same package as DRV8329

    Regards,

    Yara

  • Hi Yara, 

    Thanks for your reply, however the app note is related to the solder paste coverage, while the question of kyocera relates to the optimal coverage in percentage of the pad area after reflow. Do you have an application note also on this?

    BR

    Oscar

  • Hi Oscar,

    I found this in the app note I linked:

    Regards,

    Yara