Other Parts Discussed in Thread: DRV8329, DRV8353
Tool/software:
Hi,
My costumer requires an information for our process quality control regarding soldering quality of the exposed pad of the driver.
To ensure the quality of the soldering beneath the exposed pad it is checked by X-Ray.
With the image from the X-Ray cavities in the soler can be detected.
How much of the area of the exposed pad has at least to be soldered to the PCB ( % of the whole area) in order to ensure a good heat conduction and thus cooling of the device.
Of course, ideally the whole pad would be soldered without any cavity, but we would require a minimum value to set a threshold for the test.
Do you have any data or experience on that?
Thanks
Oscar