Tool/software:
The chip is attached to the bottom surface of the PCB, with its heat dissipation surface fitting snugly against the surface of the heat sink's boss for heat dissipation. The heat sink is connected to the bottom surface of the PCB through support pillars
What are the required control values for the distance and tolerance between the boss surface and the support column surface? If the distance is too large, the boss may not be able to make contact with the chip's heat dissipation surface; if the distance is too small, the pressure on the chip may be too great.
