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DRV8801 Thermal Resistance

Atsushi Yamauchi
Genius 4810 points
Other Parts Discussed in Thread: DRV8801-Q1, DRV8801

I would like to know the condition for the defining the thermal resistance.

How do you define the resistance?

What do you use the substrate for defining it?
( the area of the soldering and copper (top) , the number of thermal vias,
  the area of ground plane (bottom or inside), the thickness of copper, and so on)

I don't know the difference of theta ja between DRV8801 and DRV8801-Q1.
If you can, could you please teach it (and dissipation raiting) about DRV8801-Q1?
(If you can not, I will ask Automotive post about it.)

Best regards,
Atsushi Yamauchi

  • 0
    TI__Expert 7455 points

    Hi Yamauchi-san,

    To determine thermal impedance we use thermal simulations. There is an internal team solely dedicated to providing this information throughout a very powerful simulation package. To do this math by hand is not an easy feat and I am not aware of anybody using such a method nowadays.

    Other information such as area of soldering, number of thermal vias, ground plane area, copper thickness can be extracted from the application note SLMA002. The packaging group has been collecting this information for some time. I believe most of the suggestions are based on empirical data. Using these suggestions is highly recommended.

    Best regards,

    Jose Quinones