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DRV10975: Soldering Document

Part Number: DRV10975

Hello TI

Could you provide the DRV10975's soldering document data?

Does this data have the same parameters as the capacitance, resistor and solder paste requirements?

OR, how can this IC be ensured to SMT together with capacitance and resistor?

Thank you.

  • Hello Kaine,

    I'm not sure what "DRV10975 soldering document data" means. Do you have an example document so I know can understand what your are asking for?

    If you are asking about soldering info about the DRV10975PWP or DRV10975RHF packages, it sounds like you are asking about soldering information about the HTSSOP and VQFN packages, respectively. This is not specific to the device specific and needs to be looked at in context of how solder interacts with the HTSSOP and VQFN packages.

    If you are asking about how to layout our board with the DRV10975, we have design and gerber files for our DRV10975EVM. These files will include solder paste dimensions and spacing for the DRV10975 as well as the board with the passive resistor and capcitor components.

    If you need package dimensions so you can design a footprint for our device, you can find that in the bottom of the DRV10975 datasheet. There is mechanical info for both the HTSSOP and VQFN package types.

    Best,

    -Cole

  • Hello Cole

    Thanks for your replying.

    We need a Reflow Profile data for DRV10975PWPR, and this data contains reflow temperature and reflow time.

    We also want to know how this data is compatible with capacitance and resistor reflow temperature for SMT?

  • Hello Kaine,

    Apologizes for taking so long to reply.

    After talking with our packaging team, yes, the DRV10975PWP is in line with Level-2-260C-1 YEAR reflow ratings. Since the package thickness is <1.6 mm, it also complies with the 260C peak temperature.

    They've also assured it is compatible with capacitance and resistor reflow temperature for SMT.

    Thanks,

    -Cole

  • Hello Cole

    Thank you so much.