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DRV8871-Q1: Thermal Performance without Thermal Pad Soldering

hideyuki sakai
Mastermind 6250 points
Part Number: DRV8871-Q1


Dear, Sir.

My customer is considering to apply DRV8871-Q1 for their system.

They don't have an experience for thermal pad soldering because the inspection

is impossible. So, they are asking about the thermal performace degradation

without thermal pad soldering.

The datasheet defines Rth-ja, Rth-jc(top), etc.

Could you please provide the thermal performance degradation data without thermal pad

soldering if you have.

Sorry to ask about this kind of matter, hoping to get your advice.

Best Regards,

H. Sakai

  • 0
    TI__Guru** 114905 points

    Hi Sakai-san,

    There is no information for this package, but we did find this application report for two other packages.

    Please refer to section 3.1. of 

    and section 5.2 of 

    These show that zero solder coverage could increase the Theta JA by at least 2x.