I intend to use the DRV8870 for a very low power operation (10mA max), and clearly don't need the thermal pad. For the simplicity of building a prototype by hand, can I operate the DRV8870 without the thermal pad in this low power mode? The power dissipation would be 10mA^2 x 0.35 ohms ~ 35uW which wouldn't heat up a standard SOIC-8 package. I just wanted to insure the design didn't rely upon that pad being grounded.