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DRV2510-Q1: The point of PCB design when DRV2510 be used

YUN LIN
Intellectual 535 points
Part Number: DRV2510-Q1

Hi teams,

Our team are going to mount the DRV2510 into our product.

So we are planning to design the PCB of it.

Could you help to give any advice what we must pay attention to the PCB design.

  For example, the recommended parameter of the width and thin of copper path between DRV2510 and PWM signal source;

Also, we are interested in how to make a good design of the path after output side of haptic IC,

 Beside above, is there any other advice or information about the PCB design?

If possible, we would like to have a guideline about the PCB design.

Best regards,

Yun Lin

  • 0
    TI__Guru* 84915 points

    Hi, Yun,

    Regarding the width and thing copper paths, we don't have specific requirements for it. We just recommend to use at least the pin width for the PCB traces.

    We also recommend to connect the solenoid outputs and BST pins on the top layer and do not connect them to the other layers. Also, if more than one layer is used, the thermal pad should be connected to a GND plane on both layers (in case of two layers board). If more than two layers are used, the GND plane should have its own complete layer immediately below the top layer. 

    Use around 4-6 vias to connect the thermal pad to the GND plane if many layers are used. This is useful for thermal dissipation. In addition, avoid to route the digital signals near of the output traces. This could affect the device performance and communication.

    I hope this is helpful. Please let me know if you have additional questions or comments.

    Best regards,
    Luis Fernando Rodríguez S.

  • 0 in reply to Luis Fernando Rodriguez S.
    Intellectual 535 points

    Hi Luis,

    So thanks for your details mentioned above.

    We are going to create a PCB which has 4 layers.

    Best regards.