In the implementation of strict quality control,the bad product rate of 0.1% in our production drviered by DRV8188,last year. The chip burned down. But until now, we haven't found the reason.
Threre are something still confuse me .
1. What is the condition DRV8188 trigger the thermal protection?
2. Which part of inner circurts may trigger the thermal protection?
3. Can you show me the data of save operating area of inner mosfet?The data of SOA about inner mosfets and other details about the mosfets.
4. What are the most likely to cause chip damage?
I guess there are two possibilities.First, I suspect that the internal thermal protection or temperature detection circuit fails, the second, inner mosfets exceeds the safe operating area.
But I don't know how to confirm my guess.
What's the most common damage to this chip that you've encountered before?
In the implementation of strict quality control, we have bad product rate of0.03% in the control.