UC2625: UC2625MDWREP case to junction and board to junction thermal resistance

Nico Lucchese

Part Number: UC2625

Hello,

Do you have information on the case to junction and/or the board to junction thermal resistance for UC2625MDWREP? Also what is the junction temperature rating?

Thank you,

Nico

over 4 years ago

0 Paul Parrot over 4 years ago

TI__Intellectual 2345 points

Hey Nico,

From the datasheet, the junction temperature for the UC2625 is rated for -40 to +105 C.

Unfortunately because this device is quite old, we don't currently have a thermal analysis available. I'll reach out to our packaging team and to see if they might have this information and I'll get back to you as soon as possible.

Regards,

Paul

0 Paul Parrot over 4 years ago in reply to Paul Parrot

TI__Intellectual 2345 points

Hey Nico,

We do not have the thermal analysis specifically for the UC2625. However the MUX36D08IDWR datasheet has a thermal analysis for the same 28-pin SOIC DW package which you could use a reference point.

One thing to note is the UC2625 users a larger die size, meaning the thermal resistances should actually be a bit lower than the MUX36D08IDWR.

Regards,

Paul

MUX36D08IDWR

0 Nico Lucchese over 4 years ago in reply to Paul Parrot

Prodigy 240 points

We will use that then. Thank you!

-Nico

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UC2625: UC2625MDWREP case to junction and board to junction thermal resistance