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Original question:

UC2625: UC2625MDWREP thermal resistance

UC2625: Coefficient of Thermal expansion?

Nico Lucchese
Prodigy 240 points
Part Number: UC2625

Hello, 

What is the coefficient of thermal expansion for UC2625MDWREP? I need the expansion of the mold/chassis. Thank you so much for your help!

Nico

  • 0
    TI__Mastermind 18900 points

    Hello Nico,

    Like the thermal resistance request, it'll take a bit of time. I've never heard of a request for this kind of information before, though it sounds more related to packaging type question. Any supplemental info or an example of what you're looking for would help.

    Otherwise, I assume you've already tried to swim through the Quality and Reliability section of ti.com for this info? https://www.ti.com/support-quality/environmental-info/environmental-home.html 

    Best,

    -Cole

  • 0 in reply to Cole Macias
    Prodigy 240 points

    Hello Cole, 

    I looked in the link you provided. There is information on packaging and component geometry but nothing on mold compound or associated coefficient of thermal expansion that I could find. I need this information for a PWB level solder joint fatigue life analysis I am performing. Any help would be appreciated. 

    I am looking for something like this:

    Thermal expansion Alpha 1    ? X10-6 /ºC,

    Thermal expansion Alpha 2    ? X10-6/ºC,

    Glass Transition temp = ?

    Thank you,

    Nico 

  • 0 in reply to Nico Lucchese
    TI__Mastermind 18900 points

    Hello Nico,

    We're getting some clarifying questions from the thermal team: Are there measurement or simulation standards to provide what you're are asking for? Is the end goal to get the entire device's CTE? Would you like us to provide that instead?

    Do you also know if your company has an NDA with us? This information definitely falls under that criteria.

    Best,

    -Cole