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TLC5947: PCB layout footprint

Part Number: TLC5947

Page 30 and Page 32 of datasheet shows slightly different data. They have different copper pad sizes. P32 specifies larger copper pads which then require larger solder mask openings. The thermal pad size is also very different.

On Page 32, top section shows the exposed pads, the bottom shows two different options for soldermask which matches the above pads. Page 33 then provides the paste mask to suit the pads.

Which is the correct one to follow? Is there any drawing file to provide to customer?