TLV755P: Vout latch-up by ESD

ACGUY

Part Number: TLV755P

Hello E2E,

Our customer is testing the power circuit using TLV75533P.
They tried ESD. The Vout of TLV75533P rose from 3.3-V to near 4.5-V, Vout remains the same, it does not to fall.
When Vin for the device toggled on/off, device to be normal.

Does TI able to advice about lach-up by ESD?

Regards,
ACGUY

over 4 years ago

0 Stephen Ziel over 4 years ago

TI__Mastermind 37005 points

Hello ACGUY,

The TLV755P meets the following ESD specifications. Can you comment on what type of ESD was used in the test?

Thanks,

- Stephen

0 ACGUY over 4 years ago in reply to Stephen Ziel

Guru 11170 points

Hello Stephen,

Thank you for reply.
The ESD test condition are follows;
- ESD level
:-15kV
- ESD applied point
:Iron plate directly under the LDO (earth connection point)
- Vin
:5V
- Vout
:3.3V/30mA(max)

Can you let me know the means to increase ESD resistance?

Regards,
ACGUY

+1 Stephen Ziel over 4 years ago in reply to ACGUY

TI__Mastermind 37005 points

Hello ACGUY,

This level of ESD is above the values listed in the datasheet table. If the customer needs additional ESD protection, they can look into MOV or TVS protection devices.

Here is a series from TI on this topic which may be useful:

https://training.ti.com/esd-essentials-how-select-esd-protection

This system level ESD guide may be helpful:

https://www.ti.com/lit/sg/sszb130c/sszb130c.pdf

This app note may be useful:

https://www.ti.com/lit/an/slyt492/slyt492.pdf

Thanks,

- Stephen

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TLV755P: Vout latch-up by ESD