Hi,
I would like to know if the termination finish is ENIG. Would gold removal be required for this part per IPC J-STD-001 (i.e. gold embrittlement mitigation)?
Thanks,
Claudia
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Hi,
I would like to know if the termination finish is ENIG. Would gold removal be required for this part per IPC J-STD-001 (i.e. gold embrittlement mitigation)?
Thanks,
Claudia
Hi, Claudia,
We publish our material BOMs for our devices. I hope this link works for you:
https://www.ti.com/quality-reliability-packaging-download/report?opn=UCC20225NPLT
If not, you can get to the info by going through this page. You might have to click thru a few screens to see the full list.
https://www.ti.com/materialcontent/home
Best regards,
Don
Thank you, but this doesn't specify gold thickness. Can you confirm the Au thickness? I'm assuming the finish is electrolytic NiAu as opposed to ENIG... so gold removal is required, correct?
Hi Claudia,
You are correct, it is electrolytic finish with a gold thickness of ~ 0.45 um for UCC20225. You only consider to remove gold if thickness exceed 2.5um per IPC/JEDEC J-STD-001. The following image is from the IPC/JEDEC J-STD-001 standard.
Thank you very much for reaching out. Let us know if this answers your question.
Best
Francisco Lauzurique
Thank you for the information! I think in this case, gold removal would be required based on the second bullet point, "surface mount components to be soldered regardless of gold thickness".
Hi Claudia,
Happy to help, I will go ahead and close this thread. Thank you very much for reaching out.
Best
Francisco Lauzurique