We're looking for the max. power dissipation with package type. Could you share this for customer's thermal evaluation! Very thanks.
Regards
Brian W
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We're looking for the max. power dissipation with package type. Could you share this for customer's thermal evaluation! Very thanks.
Regards
Brian W
Hi Brian,
Thanks for reaching out to us!
1. Package type is 20 pin WQFN
2. We don't have a spec like max power dissipation. Device has a thermal shutdown feature. During stress events such as overcurrent or short at output when power dissipation across device increases then the junction temperature of IC also increases. When this junction temperature crosses the thermal shutdown threshold the device turns off.
Regards
Kunal Goel
In the other device, there is a specified max. power dissipation.
Is it possible to calculate since my customer would like to get this parameter to do the thermal simulation. Thanks.
Regards
Brian W
Hi Brian,
As I mentioned that device has thermal shutdown protection. So we can estimate max power dissipation before device hits thermal shutdown like this:
1. Tj(junction temperature)=Ta(ambient temperature)+[Pd(Power dissipation)*RθJA(Junction-to-ambient thermal resistance)]
2. When Tj=160C device hits thermal shutdown
3. So putting Tj<160C will give max power dissipation allowed to prevent thermal shutdown.
4. Pd(max)=(160-TA)/RθJA ,RθJA=38.1
Also during normal device operation when there is no overcurrent(current<current limit) then max power dissipation=(RON*Max operating current)
Regards
Kunal Goel
Hi Brian,
Closing thread for now. Let me know if you have further queries.
Regards
Kunal Goel