Hello,
I work for a circuit board contractor and we have a client wanting the use the TI part LP5562. Package is a DSBGA.
I have checked your datasheet and I want to know how can I get a good print?
According to the the specifications on the datasheet (YQE0012) for stencil design, the stencil apertures should be 0.25mm (9.842mils) trapezoidal rounded walls.
If I use a 4thou stencil, type IV solder paste, I cannot get the Area Ratio of 0.66 to get good solder paste separation. My ratio equals 0.615.
Do you have any ideas please?
Kind regards
Jason Dean
Production Manager
Advanced Technology and Manufacturing
9/55 Howe St Osborne Park WA AUSTRALIA 6017
Ph: 61 8 9444 3288
Mobile: 0402340647
