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BQ76PL455A: In application with communication bridge the first Chip in line always dies

Part Number: BQ76PL455A

Good Day

We are using the BQ76PL455A to manage LiPo batteries of a car-like device. The setup of the daisy chain is as in Use Case scenarios page 3, Figure 1. 

The whole system works reliably up to roughly 400V and from 400V upwards the problems begin. A precharge for the inverter can be conducted successfully but the moment the inverter starts switching, voltage levels on the communication bridge PCB start breaking down. This doesn't always happen. Whenever this happens, the first PCB in the daisy chain breaks. All the capacitors and resistors are still intact afterwards, but the BQ76 chip seems to be broken. The assumption is, that the low communication peripherals break through an overvoltage pulse on the communication line, or an induced current. 

The Communication bridge communicates with a microcontroller, which also controls the relays (high side, low side, precharge). The microcontroller/communication bridge is isolated from the rest of the electric circuits with isolated DCDCs and optocouplers.

We think there is a potential/ground problem, as the isolated Side of the Communication bridge, if looked at with the oscilloscope it roughly lies between HV+ and HV-, but jumps by several 100 volts with exactly the inverterfrequency. This potential difference probably is the reason for the broken BQ chip. As the potential difference seemed to be a problem, and the communication bridge floating, we connected the communication bridge ground  to the first PCB in the daisy chain. This made the potential problem worse. 

Is there a reason that would make the connection of the communication bridge gnd and first BQ chip gnd impossible? How can one get the potential of the communication bridge to a correct level for the BQ chip not to break?

Thank you very much for your help.

  • Hi Noemi,

    It is best to isolate the bridge from the HV stack if possible since you could risk a HV spike on your low voltage electronics. However, the spike itself is the issue and should be filtered out as you know the device would not support 100V (abs max for TOP of 88V). Can this be addressed on the system to reduce the impact to the grounding? Do you have XY caps to filter out from chassis gnd?

    Regards,

    Taylor

  • Hi Taylor

    Thank you very much for your answer. Is there a good way to isolate the bridge from the HV stack? A suitable IC or other way to do this. We first thought of using optocouplers, but these will not work, as the communication is bidirectional. Do i see this correctly? We sadly do not have time to redesign the entire PCB. I did know that 100V is the maximum difference, but did not anticipate our massive jumps in the ground-level. 
    Regarding XY caps, the chassis ground is connected to the low voltage ground at an IMD (Isolation Monitoring Device). The uC, Communication bridge and daisy chain are however isolated from the LV. We actually do not have XY caps. We have capacitors in the inverter, but not as safety EMI measures. Do you think this could help the jumping GND? How would you suggest attaching them for this setup?

    Furthermore we tried to connect the ground of the first daisy chained chip to the communication bridge, which doesn't seem like it should impact the system negatively, as it pulls the ground level of the communication bridge, to that of the first daisy chain. When we did this there was a problem with the powersupply. We assume the DCDC converters could not control fast enough. Have you heard of this problem before? Could this work from a BQ chip point of view?

    Thanks a lot in advance for your answer!


    Regards,
    Noemi

  • Hi Noemi,

    1) Typically use of digital isolator (ISO 7342) or optocoupler is the best method on the MCU side. But for daisy chain, it is a differential protocol so the twisted pair isolation caps/chokes like on our reference schematic is to isolate each device in the daisy chain

    2) Yes this could help. XY cap section is explained in our https://www.ti.com/lit/an/slua776/slua776.pdf but placement in actual pack would depend on your system chassis etc.

    3) As I said the ground should be isolated so this isn't our recommendation. If there is gnd shift it is a system issue that must be addressed unrelated to our device

    Regards,

    Taylor