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BQ40Z50-R2: Maximum Case/Junction Temperature for BQ40z50R2

Alex Fields1
Prodigy 125 points
Part Number: BQ40Z50-R2
The BQ chip specification notes a maximum ambient condition (Ta) of 85°C which, apart from a local velocity spec, must be presumed to be quiescent air. It is a given that the junction temperature of any heat dissipating IC will be operating at a higher temperature than the ambient air into which the heat is rejected (heat only flows from high temp to low temp), however, no junction or case temperature specification is provided to ensure thermal compliance of the device in the event that forced convection (non-quiescent air) across the IC is present. Can you please provide the maximum case and/or junction temperature for the IC?
  • 0
    TI__Guru** 105760 points

    Hello Alex,

    We do not characterize for forced air (different LFM ratings) like heatsinks. Forced air would likely have a small effect since the thermal resistance is lowest through the pad and thus your PCB layout would be best for dissipating heat without a heatsink on the case top.

    Sincerely,

    Wyatt Keller

  • 0 in reply to Wyatt Keller
    Prodigy 125 points

    Hi Wyatt,

    Thanks, but this did not answer my original question: Do you have a physical temperature spec for the device itself (case or junction)?

  • 0 in reply to Alex Fields1
    TI__Guru** 105760 points

    Hello Alex,

    Gauges do not usually need much heat dissipation because there is no high currents through them. The -40degC and 85degC values are given for the ambient temperature which the case would also be forced to. I would relate the temperature specification to the case temperature.

    Sincerely,

    Wyatt Keller