LMZ10500: Reliability Report

Hi Brian,

You can find reliability data in the ordering and quality section of the product folders and then selecting "Quality, reliability & packaging information": https://www.ti.com/quality-reliability-packaging-download/report?opn=LMZ10500SILR 

Regards,
Davor

Hello Pavlovski,

Thanks. What customer need is the Bake conditions according to JEDEC J-STD-033. Could you offer such info to us?

Here is an example:

Regards

Brian W

Hi Brian,

I will check with our quality team and I will come back to you as soon as possible.

Regards,
Davor

Thanks. Since customer will do the re-soldering on existing board. We'd like to know if baked temp is less than 100C, How many baked hour is? 

Regards

Brian W

One more question. After IC is bake with certain temp, how much time that device needs to finish the SMT manufacturing?

Regards

Brian W

Hi Brian,

Can you expand on your question with more details please?
Are you asking about the re-flow profile?

Regards,
Davor

Since customer call back the board from customer site since one of devices on the board has issue. Thus, customer would like to change device and doing re-soldering for all devices on the pcb board. so before PCB board does the re-flow, it needs to do the bake. If this is a case, after bake with the PCB and LMZ10500, how much time need to finish the reflow process after bake? Thanks.